This report contains market size and forecasts of Wafer Bonding Equipment in global, including the following market information:
Global Wafer Bonding Equipment Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Wafer Bonding Equipment Market Sales, 2017-2022, 2023-2028, (Units)
Global top five Wafer Bonding Equipment companies in 2021 (%)
The global Wafer Bonding Equipment market was valued at 316.7 million in 2021 and is projected to reach US$ 461 million by 2028, at a CAGR of 5.5% during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Fully Automatic Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Wafer Bonding Equipment include EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machinetool, Ayumi Industry, Shanghai Micro Electronics, U-Precision Tech and Hutem, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Wafer Bonding Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer Bonding Equipment Market, Ingecal, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Wafer Bonding Equipment Market Segment Percentages, Ingecal, 2021 (%)
Fully Automatic
Semi Automatic
Global Wafer Bonding Equipment Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Wafer Bonding Equipment Market Segment Percentages, by Application, 2021 (%)
MEMS
Advanced Packaging
CIS
Others
Global Wafer Bonding Equipment Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Wafer Bonding Equipment Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wafer Bonding Equipment revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Wafer Bonding Equipment revenues share in global market, 2021 (%)
Key companies Wafer Bonding Equipment sales in global market, 2017-2022 (Estimated), (Units)
Key companies Wafer Bonding Equipment sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
EV Group
SUSS MicroTec
Tokyo Electron
Applied Microengineering
Nidec Machinetool
Ayumi Industry
Shanghai Micro Electronics
U-Precision Tech
Hutem
Canon
Bondtech
TAZMO
TOK

1 Introduction to Research & Analysis Reports
1.1 Wafer Bonding Equipment Market Definition
1.2 Market Segments
1.2.1 Market Ingecal
1.2.2 Market by Application
1.3 Global Wafer Bonding Equipment Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Wafer Bonding Equipment Overall Market Size
2.1 Global Wafer Bonding Equipment Market Size: 2021 VS 2028
2.2 Global Wafer Bonding Equipment Revenue, Prospects & Forecasts: 2017-2028
2.3 Global Wafer Bonding Equipment Sales: 2017-2028
3 Company Landscape
3.1 Top Wafer Bonding Equipment Players in Global Market
3.2 Top Global Wafer Bonding Equipment Companies Ranked by Revenue
3.3 Global Wafer Bonding Equipment Revenue by Companies
3.4 Global Wafer Bonding Equipment Sales by Companies
3.5 Global Wafer Bonding Equipment Price by Manufacturer (2017-2022)
3.6 Top 3 and Top 5 Wafer Bonding Equipment Companies in Global Market, by Revenue in 2021
3.7 Global Manufacturers Wafer Bonding Equipment Product Type
3.8 Tier 1, Tier 2 and Tier 3 Wafer Bonding Equipment Players in Global Market
3.8.1 List of Global Tier 1 Wafer Bonding Equipment Companies
3.8.2 List of Global Tier 2 and Tier 3 Wafer Bonding Equipment Companies
4 Sights by Product
4.1 Overview
4.1.1 By ecal - Global Wafer Bonding Equipment Market Size Markets, 2021 & 2028
4.1.2 Fully Automatic
4.1.3 Semi Automatic
4.2 By ecal - Global Wafer Bonding Equipment Revenue & Forecasts
4.2.1 By ecal - Global Wafer Bonding Equipment Revenue, 2017-2022
4.2.2 By ecal - Global Wafer Bonding Equipment Revenue, 2023-2028
4.2.3 By ecal - Global Wafer Bonding Equipment Revenue Market Share, 2017-2028
4.3 By ecal - Global Wafer Bonding Equipment Sales & Forecasts
4.3.1 By ecal - Global Wafer Bonding Equipment Sales, 2017-2022
4.3.2 By ecal - Global Wafer Bonding Equipment Sales, 2023-2028
4.3.3 By ecal - Global Wafer Bonding Equipment Sales Market Share, 2017-2028
4.4 By ecal - Global Wafer Bonding Equipment Price (Manufacturers Selling Prices), 2017-2028
5 Sights By Application
5.1 Overview
5.1.1 By Application - Global Wafer Bonding Equipment Market Size, 2021 & 2028
5.1.2 MEMS
5.1.3 Advanced Packaging
5.1.4 CIS
5.1.5 Others
5.2 By Application - Global Wafer Bonding Equipment Revenue & Forecasts
5.2.1 By Application - Global Wafer Bonding Equipment Revenue, 2017-2022
5.2.2 By Application - Global Wafer Bonding Equipment Revenue, 2023-2028
5.2.3 By Application - Global Wafer Bonding Equipment Revenue Market Share, 2017-2028
5.3 By Application - Global Wafer Bonding Equipment Sales & Forecasts
5.3.1 By Application - Global Wafer Bonding Equipment Sales, 2017-2022
5.3.2 By Application - Global Wafer Bonding Equipment Sales, 2023-2028
5.3.3 By Application - Global Wafer Bonding Equipment Sales Market Share, 2017-2028
5.4 By Application - Global Wafer Bonding Equipment Price (Manufacturers Selling Prices), 2017-2028
6 Sights by Region
6.1 By Region - Global Wafer Bonding Equipment Market Size, 2021 & 2028
6.2 By Region - Global Wafer Bonding Equipment Revenue & Forecasts
6.2.1 By Region - Global Wafer Bonding Equipment Revenue, 2017-2022
6.2.2 By Region - Global Wafer Bonding Equipment Revenue, 2023-2028
6.2.3 By Region - Global Wafer Bonding Equipment Revenue Market Share, 2017-2028
6.3 By Region - Global Wafer Bonding Equipment Sales & Forecasts
6.3.1 By Region - Global Wafer Bonding Equipment Sales, 2017-2022
6.3.2 By Region - Global Wafer Bonding Equipment Sales, 2023-2028
6.3.3 By Region - Global Wafer Bonding Equipment Sales Market Share, 2017-2028
6.4 North America
6.4.1 By Country - North America Wafer Bonding Equipment Revenue, 2017-2028
6.4.2 By Country - North America Wafer Bonding Equipment Sales, 2017-2028
6.4.3 US Wafer Bonding Equipment Market Size, 2017-2028
6.4.4 Canada Wafer Bonding Equipment Market Size, 2017-2028
6.4.5 Mexico Wafer Bonding Equipment Market Size, 2017-2028
6.5 Europe
6.5.1 By Country - Europe Wafer Bonding Equipment Revenue, 2017-2028
6.5.2 By Country - Europe Wafer Bonding Equipment Sales, 2017-2028
6.5.3 Germany Wafer Bonding Equipment Market Size, 2017-2028
6.5.4 France Wafer Bonding Equipment Market Size, 2017-2028
6.5.5 U.K. Wafer Bonding Equipment Market Size, 2017-2028
6.5.6 Italy Wafer Bonding Equipment Market Size, 2017-2028
6.5.7 Russia Wafer Bonding Equipment Market Size, 2017-2028
6.5.8 Nordic Countries Wafer Bonding Equipment Market Size, 2017-2028
6.5.9 Benelux Wafer Bonding Equipment Market Size, 2017-2028
6.6 Asia
6.6.1 By Region - Asia Wafer Bonding Equipment Revenue, 2017-2028
6.6.2 By Region - Asia Wafer Bonding Equipment Sales, 2017-2028
6.6.3 China Wafer Bonding Equipment Market Size, 2017-2028
6.6.4 Japan Wafer Bonding Equipment Market Size, 2017-2028
6.6.5 South Korea Wafer Bonding Equipment Market Size, 2017-2028
6.6.6 Southeast Asia Wafer Bonding Equipment Market Size, 2017-2028
6.6.7 India Wafer Bonding Equipment Market Size, 2017-2028
6.7 South America
6.7.1 By Country - South America Wafer Bonding Equipment Revenue, 2017-2028
6.7.2 By Country - South America Wafer Bonding Equipment Sales, 2017-2028
6.7.3 Brazil Wafer Bonding Equipment Market Size, 2017-2028
6.7.4 Argentina Wafer Bonding Equipment Market Size, 2017-2028
6.8 Middle East & Africa
6.8.1 By Country - Middle East & Africa Wafer Bonding Equipment Revenue, 2017-2028
6.8.2 By Country - Middle East & Africa Wafer Bonding Equipment Sales, 2017-2028
6.8.3 Turkey Wafer Bonding Equipment Market Size, 2017-2028
6.8.4 Israel Wafer Bonding Equipment Market Size, 2017-2028
6.8.5 Saudi Arabia Wafer Bonding Equipment Market Size, 2017-2028
6.8.6 UAE Wafer Bonding Equipment Market Size, 2017-2028
7 Manufacturers & Brands Profiles
7.1 EV Group
7.1.1 EV Group Corporate Summary
7.1.2 EV Group Business Overview
7.1.3 EV Group Wafer Bonding Equipment Major Product Offerings
7.1.4 EV Group Wafer Bonding Equipment Sales and Revenue in Global (2017-2022)
7.1.5 EV Group Key News
7.2 SUSS MicroTec
7.2.1 SUSS MicroTec Corporate Summary
7.2.2 SUSS MicroTec Business Overview
7.2.3 SUSS MicroTec Wafer Bonding Equipment Major Product Offerings
7.2.4 SUSS MicroTec Wafer Bonding Equipment Sales and Revenue in Global (2017-2022)
7.2.5 SUSS MicroTec Key News
7.3 Tokyo Electron
7.3.1 Tokyo Electron Corporate Summary
7.3.2 Tokyo Electron Business Overview
7.3.3 Tokyo Electron Wafer Bonding Equipment Major Product Offerings
7.3.4 Tokyo Electron Wafer Bonding Equipment Sales and Revenue in Global (2017-2022)
7.3.5 Tokyo Electron Key News
7.4 Applied Microengineering
7.4.1 Applied Microengineering Corporate Summary
7.4.2 Applied Microengineering Business Overview
7.4.3 Applied Microengineering Wafer Bonding Equipment Major Product Offerings
7.4.4 Applied Microengineering Wafer Bonding Equipment Sales and Revenue in Global (2017-2022)
7.4.5 Applied Microengineering Key News
7.5 Nidec Machinetool
7.5.1 Nidec Machinetool Corporate Summary
7.5.2 Nidec Machinetool Business Overview
7.5.3 Nidec Machinetool Wafer Bonding Equipment Major Product Offerings
7.5.4 Nidec Machinetool Wafer Bonding Equipment Sales and Revenue in Global (2017-2022)
7.5.5 Nidec Machinetool Key News
7.6 Ayumi Industry
7.6.1 Ayumi Industry Corporate Summary
7.6.2 Ayumi Industry Business Overview
7.6.3 Ayumi Industry Wafer Bonding Equipment Major Product Offerings
7.6.4 Ayumi Industry Wafer Bonding Equipment Sales and Revenue in Global (2017-2022)
7.6.5 Ayumi Industry Key News
7.7 Shanghai Micro Electronics
7.7.1 Shanghai Micro Electronics Corporate Summary
7.7.2 Shanghai Micro Electronics Business Overview
7.7.3 Shanghai Micro Electronics Wafer Bonding Equipment Major Product Offerings
7.7.4 Shanghai Micro Electronics Wafer Bonding Equipment Sales and Revenue in Global (2017-2022)
7.7.5 Shanghai Micro Electronics Key News
7.8 U-Precision Tech
7.8.1 U-Precision Tech Corporate Summary
7.8.2 U-Precision Tech Business Overview
7.8.3 U-Precision Tech Wafer Bonding Equipment Major Product Offerings
7.8.4 U-Precision Tech Wafer Bonding Equipment Sales and Revenue in Global (2017-2022)
7.8.5 U-Precision Tech Key News
7.9 Hutem
7.9.1 Hutem Corporate Summary
7.9.2 Hutem Business Overview
7.9.3 Hutem Wafer Bonding Equipment Major Product Offerings
7.9.4 Hutem Wafer Bonding Equipment Sales and Revenue in Global (2017-2022)
7.9.5 Hutem Key News
7.10 Canon
7.10.1 Canon Corporate Summary
7.10.2 Canon Business Overview
7.10.3 Canon Wafer Bonding Equipment Major Product Offerings
7.10.4 Canon Wafer Bonding Equipment Sales and Revenue in Global (2017-2022)
7.10.5 Canon Key News
7.11 Bondtech
7.11.1 Bondtech Corporate Summary
7.11.2 Bondtech Wafer Bonding Equipment Business Overview
7.11.3 Bondtech Wafer Bonding Equipment Major Product Offerings
7.11.4 Bondtech Wafer Bonding Equipment Sales and Revenue in Global (2017-2022)
7.11.5 Bondtech Key News
7.12 TAZMO
7.12.1 TAZMO Corporate Summary
7.12.2 TAZMO Wafer Bonding Equipment Business Overview
7.12.3 TAZMO Wafer Bonding Equipment Major Product Offerings
7.12.4 TAZMO Wafer Bonding Equipment Sales and Revenue in Global (2017-2022)
7.12.5 TAZMO Key News
7.13 TOK
7.13.1 TOK Corporate Summary
7.13.2 TOK Wafer Bonding Equipment Business Overview
7.13.3 TOK Wafer Bonding Equipment Major Product Offerings
7.13.4 TOK Wafer Bonding Equipment Sales and Revenue in Global (2017-2022)
7.13.5 TOK Key News
8 Global Wafer Bonding Equipment Production Capacity, Analysis
8.1 Global Wafer Bonding Equipment Production Capacity, 2017-2028
8.2 Wafer Bonding Equipment Production Capacity of Key Manufacturers in Global Market
8.3 Global Wafer Bonding Equipment Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 Wafer Bonding Equipment Supply Chain Analysis
10.1 Wafer Bonding Equipment Industry Value Chain
10.2 Wafer Bonding Equipment Upstream Market
10.3 Wafer Bonding Equipment Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 Wafer Bonding Equipment Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer